{"version":"1.0","provider_name":"Digital Integrated Circuits Design Bootcamp Guadalajara","provider_url":"https:\/\/asic-chile.cl\/tecmx","author_name":"jpalacios","author_url":"https:\/\/asic-chile.cl\/tecmx\/author\/jpalacios\/","title":"Lecturers - Digital Integrated Circuits Design Bootcamp Guadalajara","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"kntDcQwzDB\"><a href=\"https:\/\/asic-chile.cl\/tecmx\/lecturers\/\">Lecturers<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/asic-chile.cl\/tecmx\/lecturers\/embed\/#?secret=kntDcQwzDB\" width=\"600\" height=\"338\" title=\"\u00abLecturers\u00bb \u2014 Digital Integrated Circuits Design Bootcamp Guadalajara\" data-secret=\"kntDcQwzDB\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/asic-chile.cl\/tecmx\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>\n","description":"Lecturers January 12th \u2013 16th, 2026 | 9:00 AM \u2013 6:00 PM daily Tecnol\u00f3gico de Monterrey, Nuevo Le\u00f3n Av. Gral. Ram\u00f3n Corona No 2514, Colonia Nuevo M\u00e9xico, 45201 Zapopan, Jal. Victor Grimblatt Victor Grimblatt has an engineering diploma in microelectronics from Institut Nationale Polytechnique de Grenoble (INPG \u2013 France) and an electronic engineering diploma from [&hellip;]","thumbnail_url":"https:\/\/asic-chile.cl\/tecmx\/wp-content\/uploads\/sites\/22\/2025\/12\/Victor-Grimblatt.png","thumbnail_width":205,"thumbnail_height":245}